• 交易日期 2025/03/16 提單編號 maeu250216501
• 供應(yīng)商 hp inc.inventec chongqing corp. 采購商 iec techologies, s. de r.l. de c.v.
• 出口港 57078, yantian 進口港 2704, los angeles, ca
• 供應(yīng)區(qū) China 采購區(qū) United States
• 重量 1222kg 金額 ——
• HS編碼 847330 產(chǎn)品標(biāo)簽 ct a,mexico,ale,cf,module,gf,halogen free,arg,h61,mill,a sv,click,unit,tin,screw,usb,pet,cross,el ad,pc,hpi,otto,pcb,carton,fin,lease,3m,bb,lara,ion,mac,chips,mal,halo,raw material,sant,cod,fr4,n bl,cro
• 產(chǎn)品描述 HOLDER,BOTTOM IO, LEFT,PC+AB S,16 SCREW,I,M2.0,5MM,MACH, 4.5MM,0.8MM,CROSS, SCREW,I ,M1.2,2.3MM, MACH,2.6MM,0.3M M,CROS FFC,6P ALS,239.5X3.5 X0.3MM,0.3/0.5MM,PET FFC,1 6P IR,161X10X 0.3MM,0.3/0.5M M,PET,S, FFC,8P FINGER,66X4. 5 X0.3MM,0.3/0.5MM,PET FFC ,10P CLICK,56X5.5 X0.3MM,0.3 /0.5MM,PET PCB,MB,10L,FR4, HALOGEN FREE+ ROHS2 PCB,ACS ,10L,FR4, HALOGEN FREE+ ROHS 2 PCB,MIC,10L,FR4, HALOGEN FREE+ ROHS2 PCB,USB,10L,FR4 , HALOGEN FREE+ ROHS2 PCB, MB,8L,FR4, HALOGEN FREE+ ROH S2 PCB,ALS,8L,HALONGFREE,ENT EK PCB,USB,8L,FR4, HALOGEN FREE+ ROHS2 PCB,MIC,8L,FR4, HALOGEN FREE+ ROHS2 ASSEM BLY,CASE,BOTTOM,THIN,14 THER MAL MODULE,INTEL ADL_U,UMA,2 8W,CHIPS PART NO: H6111382, H6111387,H6111388, H611140 5,H6111407, H6111414,H611142 2, H6120003,H6120004, H612 0005,H6120007, H6120014,H612 0015, H6120016,H6120017, H 6121513,H6120019, PO: 451713 7937, 4517137941,4517137942, 4517137955,4517137956, 45 17137962,4517137968, 4517149 666,4517149668, 4517149669,4 517149670, 4517149677,451714 9678, 4517149679,4517149680, 4517153527,4517149682, IN V: H629111382, H629111387,H6 29111388, H629111405,H629111 407, H629111414,H629111422, H629120003,H629120004, H62 9120005,H629120007, H6291200 14,H629120015, H629120016,H6 29120017, H629121513,H629120 019, HS CODE:8473309000, 7 318159090,8544491900, 853400 1000, 130 CARTONS INTO 8 PAL LETS HPI-IMX - RAW MATERIALS OCF/DESTINATION/LOCAL CHARG ES COLLECT AT USA BY HP USA SVC:33101405359 AS THIS IS SPECIAL ARRANGE, PLEASE TAK E THE REMARK FOR BB8 TO INVE NTEC MEXICO ON BL.ALSO, PLEA SE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRAN GEMENT. NOTIFY3: HP INC. 1501 PAGE MILL ROAD SANTA C LARA 94304 PALO ALTOUNITED S TATES AMS.OCEAN.PREALERT@HP. COM (650)857-1501 ---TEL : 1- (915) 298-5210 / 52-656- 2761340
  

• 交易日期 2025/03/16 提單編號 maeu250292252
• 供應(yīng)商 hp inc.inventec chongqing corp. 采購商 iec techologies, s. de r.l. de c.v.
• 出口港 57078, yantian 進口港 2704, los angeles, ca
• 供應(yīng)區(qū) China 采購區(qū) United States
• 重量 2160.5kg 金額 ——
• HS編碼 210690 產(chǎn)品標(biāo)簽 h61,304 h
• 產(chǎn)品描述 H6120263 H6120268 H6120278 H 6120283 H6120284 H6120292 H612 0293 H6120294 H6120296 H61202 97 H6120298 H6120299 H6120301 H6120304 H6120307 H6120308 H6 120310 H6120323 H6120329 H6120 331 H6120332 H6120333 H612033 9 H6120340 H6120341 H6120344 H6120348 H6120350 H6120351 H61 20355 H6120357 H6120358 H6120 360 H6120364 H6120368 H6120369 H6120371 H6120372 H6120373 H 6120380 H6120382 H6120383 H612 0384 H6120386 H6120389 H61203 95 H6120400 H6120402 H6120412 H6120416 H6120417 H6120418 H6 120425 H6120426 H6120428 H6120 430 H6120431 H6120433 H612043 5 H6120443 H6120444 H6120445 H6120449 H6120450 H6120455 H61 20469 H6120471 H6121395 H6121 399 H6121400 H6121401 H6121402 H6121405 H6121406 H6121407 H 6121411 H6121413 H6121414 H612 1416 H6121420 H6121421 H61214 22 H6121423 H6121425 H6121429 H6121430 H6121431 H6121433 H6 121434 H6121435 H6121439 H6121 440 H6121443 H6121444 H612144 5 H6121446 H6121447 H6121448 H6121450 H6121451 H6121452 H61 21454 H6121455 H6121456 H6121 457 H6121458 H6121459 H6121460 H6121462 H6121463 H6121464 H 6121465 H6121466 H6121467 H612 1468 H6121469 H6123755 H61200 33 H6120043 H6120050 H6120374 H6120460 H6120466 PO#: 4517149760 4517137964 4517149685 4517149958 45171497 04 4517149960 4517149970 4517 149971 4517149972 4517149977 4517149729 4517149984 45171497 31 4517149990 4517149992 4517 149993 4517149994 4517150004 4 517150005 4517150006 45171500 07 4517149754 4517150012 45171 49762 4517149764 4517149772 4 517150029 4517149779 451715003 4 4517149780 4517149781 45171 50036 4517150038 4517149784 45 17150042 4517149789 451715004 5 4517150046 4517150051 451715 0053 4517150054 4517149799 45 17149800 4517150056 4517149804 4517149805 4517150060 451714 9808 4517150065 4517149811 45 17150066 4517150069 4517149815 4517149817 4517149818 451714 9819 4517150075 4517149822 451 7150080 4517149827 4517149828 4517149829 4517150083 4517149 830 4517149831 4517149836 451 7150095 4517150099 4517149848 4517149852 4517150104 4517149 853 4517149854 4517150106 4517 149855 4517150107 4517150108 4517149859 4517149861 45171498 62 4517149863 4517149871 4517 149874 4517149875 4517150126 4517149876 4517150130 45171498 80 4517150131 4517149882 4517 149884 4517149885 4517150136 4 517149889 4517150140 45171498 91 4517149892 4517149894 45171 49896 4517150146 4517149898 4 517149899 4517150149 451715015 3 4517150154 4517149905 45171 50155 4517150156 4517149909 45 17150162 4517149916 451714991 7 4517150173 4517150175 451714 9927 4517150176 4517149931 45 17150182 4517150183 4517150184 4517150185 4517150186 451715 0187 4517149941 4517150195 45 17149942 4517149945 4517150198 4517149948 4517150209 451715 0211 4517149969 4517149996 451 7150000 4517150002 4517150003 4517149759 4517150014 4517150 015 4517149770 4517150035 451 7150048 4517149802 4517149813 4517149816 4517150072 4517150 074 4517150085 4517149838 4517 149839 4517149841 4517149844 4517150096 4517149846 45171501 13 4517150117 4517149886 4517 149887 4517150139 4517149897 4517150148 4517149901 45171501 58 4517149910 4517149913 4517 150168 4517150171 4517150172 4 517149925 4517150179 45171501 80 4517149934 4517150192 45171 49943 4517149950 4517150205 4 517149953 4517150221 451715022 2 4517150224 4517159757 45171 49697 4517149959 4517149963 45 17149900 4517149951 451714995 5 INV: H629120141 H629111417 H629 120022 H629120041 H629120042 H629120045 H629120063 H6291200 65 H629120067 H629120077 H629 120090 H629120091 H629120094 H 629120103 H629120107 H6291201 08 H629120110 H629120124 H6291 20126 H629120127 H629120129 H 629120133 H629120138 H62912014 4 H629120148 H629120158 H6291 20165 H629120173 H629120174 H6 29120175 H629120176 H62912017 7 H629120181 H629120182 H62912 0189 H629120192 H629120195 H6 29120197 H629120206 H629120208 H629120210 H629120211 H62912 0213 H629120214 H629120218 H6 29120220 H629120221 H629120224 H629120229 H629120230 H62912 0231 H629120236 H629120237 H62 9120240 H629120241 H629120243 H629120245 H629120246 H629120
  

• 交易日期 2025/03/16 提單編號 maeu248775997
• 供應(yīng)商 hp inc.inventec chongqing corp. 采購商 iec techologies, s. de r.l. de c.v.
• 出口港 57078, yantian 進口港 2704, los angeles, ca
• 供應(yīng)區(qū) China 采購區(qū) United States
• 重量 2754.26kg 金額 ——
• HS編碼 847330 產(chǎn)品標(biāo)簽 ct a,vent,mexico,ale,cf,arg,h61,mill,a sv,unit,w mat,tin,hpi,otto,carton,lease,bb,lara,amd,ion,r ra,ear,sant,thermal module,cod,chipset,n bl,display
• 產(chǎn)品描述 THERMAL MODULE,AMD FP7_U,UMA ,15W,CHIPSET ASSEMBLY,CASE, BOTTOM,THICK,14W ASSEMBLY, CASE, BOTTOM,THICK,14W ASS EMBLY,CASE,REAR, DISPLAY,WWA N,THICK,14 ASSEMBLY,CASE,REA R, DISPLAY,WWAN,THICK,14 P ART NO: H6120029, H6120058,H 6120060, H6120381,H6121510, PO: 4517149693, 4517149967 ,4517149968, 4517149904,4517 153524, INV: H629120029, H 629120058,H629120060, H62912 0381,H629121510, HS CODE:847 3309000 402 CARTONS INTO 21 PALLETS HPI-IMX - RAW MATERI ALS OCF/DESTINATION/LOCAL CH ARGES COLLECT AT USA BY HP U SA SVC:33101405359 AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB8 TO I NVENTEC MEXICO ON BL.ALSO, P LEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION AR RANGEMENT. NOTIFY3: HP INC . 1501 PAGE MILL ROAD SANTA CLARA 94304 PALO ALTOUNITE D STATES AMS.OCEAN.PREALERT@ rHuPc.ACaOzM (650)857-1501 ---TE L : 1- (915) 298-5210 / 52-6 56-2761340
  

• 交易日期 2025/03/16 提單編號 maeu248775999
• 供應(yīng)商 hp inc.inventec chongqing corp. 采購商 iec techologies, s. de r.l. de c.v.
• 出口港 57078, yantian 進口港 2704, los angeles, ca
• 供應(yīng)區(qū) China 采購區(qū) United States
• 重量 3243.69kg 金額 ——
• HS編碼 292143 產(chǎn)品標(biāo)簽 iv tape,shield,n connector,silicon rubber,thermal,keyboard,cmit,pcr,rgb,tape,insulator,fin,dh,500m module,amb,amd,fan,jack,ssd,chips,silver,finger print,lan cable,angle bracket,temperature sensor,control ler,module,back flip,h61,14mm,2 antenna,pet,smt,diode,3m,print,abs cable,resistor,s 15,led,m gasket,insulat,bt,key,ask,buck,8p connector,cod,bumper,type a,sod,v di,ppo,cf,2 lane,mah,cr2032,bezel,acetate cloth,usb,rj45,top,blower,pc,hermal,frame,4 channel,hub,usb charger,x7,mylar,md,p1,converter,n cable,s 30,uv,br a,graphite,mtl,chipset,display,trim,rene,4 module,chip,gasket,mm connector,zf,absorber,fpc,cross,el ad,pad,otto,talc,mac,coil,housing set,mal,double side,thermal module,cover,t cable,switch,batter y,abs frame,g er,audio,cpu,hips
• 產(chǎn)品描述 JACK+LED,GRE+AMB, RJ45,LCP,1 2P,11.6MM,GOL IC,HUB CONTROL LER, DP1.4,3 PORTS,BGA,168P CONNECTOR,USB 3.0, TYPE A, 3.6/6.46/7.46MM CONNECTOR,US B 3.1 GEN2,TYPE A,10.93/13.8 IC,TEMPERATURE SENSOR,QFN ,12P,TR IC,AUDIO CODEC,1.8/ 3.3V,4 CHANNEL,MQFN,4 IC,S YNCHRONOUS BUCK CONVERTER,3. 153.5VV DIODE,SCH,30V,0.6A, 225MW,SMT,SOT-23,TR CONNEC TOR,FPC,BACK FLIP,1.06/1.06M M,FL,N CONNECTOR,FPC,BACK FLIP,1.98MM,FL,BEG,1X DIODE, ESD,3.3V,SMD,SOD-523,TR IC,P OWER SWITCH,USB CHARGER,SOT-23 -5,5P, RESISTOR-CHIP,0.005,1% ,1W,0805,TR IC,AUDIO CODEC,1. 8/3.3V,4 CHANNEL,MQFN,4 GASKE T,DISPLAY,LZF20-D/CF-525,20MM, 5MM,2 SHIELD,M/B,ABSORBER,0.3 5MM GASKET,CF525,2.7MM,COIL,W WAN PAD,THERMAL,KB,0.1MM,GRAP HITE+CU,K=1500M FFC,16P IR,16 1X10X0.3MM,0.3/0.5MM,PET,S, T HERMAL MODULE,AMD FP7_U,UMA,15 W,CHIPSET INSULATOR,18MM,14MM ,0.1MM,DFR-117 FAN,BLOWER,103 .5X73.3X6.2MM,5.74CFM,143. FA N,BLOWER,103.58X73.36X6.2MM,5. 5CFM,168 TAPE,DOUBLE SIDE,10. 6MM,5.2MM,0.1MM,DST- SHIELD,D DR,SUS 304 GASKET,DISPLAY,LZF 20-D/CF-525,20MM,5MM,2 GASKET ,CF525,2.7MM,COIL,WWAN PAD,TH ERMAL,KB,0.1MM,GRAPHITE+CU,K=1 500M MODULE,FINGER PRINT,NOUV ELLE SILVER THERMAL MODULE,IN TEL MTL_P,DIS,20W,20W,D KEYBO ARD,84,BL,42P,BLACK,L/A,273.35 X111. KEYBOARD,84,NON-BL,42P, BLACK,L/A,273.35X MODULE,FING ER PRINT,NOUVELLE SILVER HOLD ER,DISPLAY,WLAN CABLE,PC+ABS FRAME,DISPLAY BEZEL,TRIM,PC+AB S 15%TALC, HOLDER,DISPLAY,WLA N CABLE,PC+ABS CABLE,ROUND,24 POS,800MM,E,BASE TBT4 CMIT SE T,HOUSING,BOTTOM SET,HOUSING, BOTTOM SET,TOP,HOUSING SET,C OVER,TOP,PCR FRAME,DISP,AL505 2RC H32 ANTENNA,WLAN,MAIN,393 MM,1.13MM,6E SHIELD,DDR COVER ,SUS 304,ABSORBER,MYLAR_ SCRE W,I,M2.0,2MM,MACH,5.2MM,0.5MM, CROSS, THERMAL MODULE,INTEL M TL_P,DIS,20W,20W,D FAN,BLOWER ,103.58X73.36X7.2MM,6.3CFM,116 THERMAL MODULE,INTEL ADL_U,U MA,28W,CHIPS THERMAL MODULE,A MD FP7_U,UMA,15W,CHIPSET THER MAL MODULE,AMD FP7_U,UMA,15W,C HIPSET CABLE,ROUND,24POS,1000 MM,E,TBT4 CMIT KEYBOARD,101,P VCY BL,42P,BLACK,USA,330.6 TH ERMAL MODULE,INTEL MTL_P,DIS,2 0W,20W,D FAN,BLOWER,103.5X73. 4X7.2MM,6.5CFM,164.8 INSULATO R,WWAN,DFR-117 PAD,THERMAL,KB ,0.1MM,GRAPHITE,K=1500MK/W CA BLE,ROUND,40POS,164MM,I,EDP,2 LANE,TOP SHIELD,DDR COVER,AMD ,SUS 304,ABSORBER,MY SHIELD,P CB,TOP,ABSORBER SHIELD,CPU BT M,AMD_WWAN,ABSORBER,DS-5,18 S HIELD,GPU_DIS,EMI,ABSORBER,BAC K ADHESIV TAPE,25MM,8MM,0.19M M,ACETATE CLOTH BUMPER,20MM,6 .5MM,1.8MM,SILICON RUBBER,A F FC,10P RGB,207X7X0.3MM,0.3/0.5 MM,PET,S, GASKET,CF525,30MM,6 MM,2MM,RECTANGLE BRACKET,SUPP ORT,AMD_TOP,SGCC,14 MODULE,FI NGER PRINT,NOUVELLE SILVER BR ACKET,SUPPORT,DIS_TOP,SGCC,14 SHIELD,SSD,SUS 304,INTEL DIB ,HP RENEW 17.3,TOPLOAD BATTER Y SET,LI,3V,220MAH,CELL,CR2032 ,21. PART NO: H6116471 H6077801 H6112620 H6112621 H6071767 H6072747 H 6078675 H6111472 H6116638 H611 6639 H6116640 H6116642 H61166 43 H6123392 H6111391 H6111392 H6111394 H6111395 H6111408 H6 111430 H6111528 H6111538 H6111 539 H6111543 H6111389 H611548 0 H6115481 H6115482 H6071470 H 6116360 H6116361 H6116362 H60 91137 H6111384 H6111386 H61163 58 H6116472 H6120025 H6120026 H6120036 H6120055 H6120059 H 6120139 H6120142 H6120157 H612 0009 H6120018 H6120020 H61200 28 H6120030 H6119992 H6119993 H6120008 H6120021 H6120047 H6 120053 H6120070 H6120113 H6120 119 H6120156 H6120203 H612020 4 H6120232 H6120249 H6120436 H 6120085 H6120012 H6120068 H61 20123 H6119995 H6121424 PO#: 4517143 815 4517060465 4517140763 4517 140765 4517045213 4517046167 4517065017 4517138019 45171438 66 4517143867 4517143868 4517 143870 4517143871 4517157764 4 517137945 4517137946 45171379 47 4517137948 4517137957 45171 37977 4517138079 4517138089 4 517138090 4517138094 451713794 3 4517143213 4517143214 45171 43215 4517045342 4517143378 4 517143379 4517143380 451709346 4 4517137939 4517137940 45171 43376 4517143800 4517149688 45 17149690 4517149700 451714971 1 4517149713 4517149758 451714 9761 4517150025 4517149672 45 17149681 4517149683 4517149692 4517149694 4517149659 451714
  

• 交易日期 2025/03/16 提單編號 maeu248775996
• 供應(yīng)商 hp inc.inventec chongqing corp. 采購商 iec techologies, s. de r.l. de c.v.
• 出口港 57078, yantian 進口港 2704, los angeles, ca
• 供應(yīng)區(qū) China 采購區(qū) United States
• 重量 2199.51kg 金額 ——
• HS編碼 847330 產(chǎn)品標(biāo)簽 ct a,mexico,ale,cf,arg,h61,mill,a sv,unit,tin,lara,hpi,carton,lease,bb,keyboard,ion,key,raw material,sant,cod,n bl
• 產(chǎn)品描述 ASSEMBLY,BASE, KEYBOARD,SUB, US,14 ASSEMBLY,BASE, KEYBO ARD,SUB,US,14 ASSEMBLY,BASE, KEYBOARD,SUB,US,14 ASSEMB LY,BASE, KEYBOARD,SUB,US,14 PART NO: H6121511 H6121515 H6121516 H6121518 PO#: 4517153525 4517153529 451715 3530 4517153532 INV: H6291 21511 H629121515 H629121516 H629121518 HS CODE: 847330 9000 347 CARTONS INTO 18 PAL LETS HPI-IMX - RAW MATERIALS OCF/DESTINATION/LOCAL CHARG ES COLLECT AT USA BY HP USA SVC:33101405359 AS THIS IS SPECIAL ARRANGE, PLEASE TAK E THE REMARK FOR BB8 TO INVE NTEC MEXICO ON BL.ALSO, PLEA SE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRAN GEMENT. NOTIFY3: HP INC. 1501 PAGE MILL ROAD SANTA C LARA 94304 PALO ALTOUNITED S TATES AMS.OCEAN.PREALERT@HP. COM (650)857-1501 ---TEL : 1- (915) 298-5210 / 52-656- 2761340
  

• 交易日期 2025/03/16 提單編號 cmdushz7043289
• 供應(yīng)商 hp inc.inventec chongqing corp. 采購商 iec techologies, s. de r.l. de c.v.
• 出口港 57078, yantian 進口港 2704, los angeles, ca
• 供應(yīng)區(qū) China 采購區(qū) United States
• 重量 5665kg 金額 ——
• HS編碼 847330 產(chǎn)品標(biāo)簽 ct a,vent,display part,mexico,spring,ale,arg,h61,mill,unit,l hi,pera,america,hpi,tin,otto,suit,carton,lease,ghwa,bb,sds,lara,ion,ear,imperia,raw material,sant,samsung,santa fe,cap,hinge,cod,n bl,display
• 產(chǎn)品描述 ASSEMBLY,CASE, BOTTOM,SUB,DIS,14 ASSEMBLY,CASE, BOTTOM,THIN,14 ASSEMBLY,CASE, BOTTOM,THICK,14W ASSEMBLY,CASE,REAR, DISPLAY,WWAN,THICK,14 SET,HINGE CAP,DISPLAY PART NO: H6120054, H6120073,H6121512, H6121514,H6120096, PO: 4517149965, 4517149975,4517153526, 4517153528,4517149732, INV: H629120054, H629120073,H629121512, H629121514,H629120096, HS CODE:8473309000 302 CARTONS INTO 17 PALLETS HPI-IMX - RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA 0005579523 AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB8 TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. TEL : 1- (915) 298-5210 /52-656-2761340 NOTIFY3: HP INC. 1501 PAGE MILL ROAD SANTA CLARA 94304 PALO ALTOUNITED STATES AMS.OCEAN.PREALERT 3HIPd.TC0OOM (650)857-1501 2ND NOTIFY:SAMSUNG SDS AMERICA, INC. 12631 E.IMPERIAL HIGHWAY, SUITE F216, SANTA FE SPRING 90670 LA.OPERATION SAMSUNG.COM JUN YEON KIM 714-497-6412
  

• 交易日期 2025/03/12 提單編號 cmdushz7043163
• 供應(yīng)商 hp inc.inventec chongqing corp. 采購商 iec techologies, s. de r.l. de c.v.
• 出口港 57078, yantian 進口港 2704, los angeles, ca
• 供應(yīng)區(qū) China 采購區(qū) United States
• 重量 3542kg 金額 ——
• HS編碼 850650 產(chǎn)品標(biāo)簽 ct a,vent,mexico,spring,ale,arg,h61,mill,unit,l hi,pera,america,tin,lara,suit,carton,lease,ghwa,bb,sds,ion,mah,ear,imperia,hpi,raw material,sant,samsung,santa fe,battery set,cod,n bl,display
• 產(chǎn)品描述 BATTERY SET,LI,3V, 70MAH,CELL,CR1620,17X2 ASSEMBLY,CASE,REAR, DISPLAY,WLAN,THIN,14P ASSEMBLY,CASE,REAR, DISPLAY,WLAN,THICK,14 PART NO: H6111499, H6071452,H6071557, PO: 4517138046, 4517044719,4517044747, INV: H629111499, H629071452,H629071557, HS CODE:8506500000, 8473309000, 201 CARTONS INTO 11 PALLETS HPI-IMX - RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA 0005579523 AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB8 TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. NOTIFY3: HP INC. 1501 PAGE MILL ROAD SANTA CLARA 94304 PALO ALTOUNITED STATES AMS.OCEAN.PREALERT 0H8P4.GCCO1M (650)857-1501 TEL : 1- (915) 298-5210 /52-656-2761340 2ND NOTIFY:SAMSUNG SDS AMERICA, INC. 12631 E.IMPERIAL HIGHWAY, SUITE F216, SANTA FE SPRING90670 LA.OPERATION SAMSUNG.COM JUN YEON KIM 714-497-6412
  

• 交易日期 2025/03/09 提單編號 maeu249112407
• 供應(yīng)商 hp inc.inventec chongqing corp. 采購商 iec techologies, s. de r.l. de c.v.
• 出口港 57078, yantian 進口港 2704, los angeles, ca
• 供應(yīng)區(qū) China 采購區(qū) United States
• 重量 2594.59kg 金額 ——
• HS編碼 700910 產(chǎn)品標(biāo)簽 ct a,vent,mexico,keyboard,cf,arg,mill,a sv,unit,tin,hpi,carton,lease,ale,bb,lara,ispl,ion,pla,ear,raw material,sant,cod,n bl,display
• 產(chǎn)品描述 ASSEMBLY,BASE,KEYBOARD,SUB,US, 14 ASSEMBLY,CASE,REAR, DIS PLAY,WLAN,THIN,14P ASSEMBLY, CASE,REAR, DISPLAY,WLAN,THIN ,14P ASSEMBLY,CASE,REAR, D ISPLAY,WLAN,THICK,14 ASSEMBL Y,CASE,REAR, DISPLAY,WWAN,TH IN,14P ASSEMBLY,CASE,REAR, DISPLAY,WLAN,THICK,14 ASSEM BLY,CASE,REAR, DISPLAY,WLAN, AG PART NO: H6071370,H607142 5, H6071437,H6071668,H607680 4, H6076822,H6093335, PO: 4517044688,4517044710, 45170 44714,4517044771,4517060241, 4517060257,4517099984, INV: H629071370, H629071425,H629 071437, H629071668,H62907680 4, H629076822,H629093335 H S CODE:8473309000 381 CARTON S INTO 21 PALLETS HPI-IMX - RAW MATERIALS OCF/DESTINATIO N/LOCAL CHARGES COLLECT AT U SA BY HP USA SVC:33101405359 AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB8 TO INVENTEC MEXICO ON BL .ALSO, PLEASE GIVE THE SPECI AL LIST TO REGION FOR DESTIN ATION ARRANGEMENT. NOTIFY3 : HP INC. 1501 PAGE MILL R OAD SANTA CLARA 94304 PALO ALTOUNITED STATES AMS.OCEAN .PREALERT@ XHuPT.gCHOSM (650)857-15 01 ---TEL : 1- (915) 298-521 0 / 52-656-2761340
  

• 交易日期 2025/03/09 提單編號 maeu249973779
• 供應(yīng)商 hp inc.inventec chongqing corp. 采購商 iec techologies, s. de r.l. de c.v.
• 出口港 57078, yantian 進口港 2704, los angeles, ca
• 供應(yīng)區(qū) China 采購區(qū) United States
• 重量 1501.42kg 金額 ——
• HS編碼 851771 產(chǎn)品標(biāo)簽 ct a,vent,5 cable,mexico,arg,ppo,cf,module,h61,pvc,tin,keyboard,ante,mill,a sv,unit,cmit,antenna,top,hpi,el ad,ntek,3m,pcb,gh,lease,ale,bb,lara,cart,bt,ion,ear,chips,mal,mult,raw material,sant,cable,bracket,cod,fr4,display
• 產(chǎn)品描述 ANTENNA,WWAN,AUX, WLAN,MAIN, 704-7125MHZ,6 ANTENNA,WWAN,M AIN, WLAL,AUX,704-7125MHZ,4 ANTENNA,WWAN,AUX3, 1.71-5. 85GHZ,195MM,1.1 ANTENNA,WLAN ,AUX, 540MM,1.37MM,6E ANTE NNA,WLAN,MAIN, 393MM,1.13MM, 6E BRACKET,TOP SUPPORT,KU500 ,5 KEYBOARD,84,BL,42P, BLA CK,CAN-FR / MULTI, KEYBOARD, 84,NON-BL, 42P,BLACK,L/A,273 .35X KEYBOARD,84,PVCY BL, 42P,BLACK,L/A,273.35 CABLE,R OUND,24POS, 800MM,E,BASE TBT 4 UNIV CABLE,ROUND,24POS, 800MM,E,BASE TBT4 UNIV CABLE ,ROUND,24POS, 800MM,E,BASE T BT4 CMIT PCB,MB,10L,FR4,ENTE K PCB,MB,8L,FR4,ENTEK ASSE MBLY,CASE,REAR, DISPLAY,WLAN ,THIN,14P ASSEMBLY,CASE,REAR , DISPLAY,WLAN,THIN,14P TH ERMAL MODULE,INTEL ADL_U,UMA ,28W,CHIPS PART NO: H6111366 , H6111367,H6111368, H6111 376,H6111377, H6093448,H6111 409, H6111411,H6111419, H6 111426,H6111427, H6111429,H6 111380, H6111381,H6071429, H6076821,H6111425, PO: 4517 137924, 4517137925,451713792 6, 4517137931,4517137932, 4517100096,4517137958, 45171 37960,4517137966, 4517137972 ,4517137974, 4517137976,4517 137935, 4517137936,451704471 1, 4517060256,4517137971, INV: H629111366, H629111367, H629111368, H629111376,H6291 11377, H629093448,H629111409 , H629111411,H629111419, H 629111426,H629111427, H62911 1429,H629111380, H629111381, H629071429, H629076821,H6291 11425, HS CODE:8517710000, 8473309000,8471607100, 8544 421100,8534001000, 196 CARTO NS INTO 11 PALLETS HPI-IMX - RAW MATERIALS OCF/DESTINATI ON/LOCAL CHARGES COLLECT AT USA BY HP USA SVC:3310140535 9 AS THIS IS SPECIAL ARRANGE , PLEASE TAKE THE REMARK FOR BB8 TO INVENTEC MEXICO ON B L.ALSO, PLEASE GIVE THE SPEC IAL LIST TO REGION FOR DESTI NATION ARRANGEMENT. NOTIFY 3: HP INC. 1501 PAGE MILL ROAD SANTA CLARA 94304 PALO ALTOUNITED STATES AMS.OCEA N.PREALERT@ PHwPU.WCfOaM (650)857-1 501 ---TEL : 1- (915) 298-52 10 / 52-656-2761340
  

• 交易日期 2025/03/09 提單編號 maeu249912066
• 供應(yīng)商 hp inc.inventec chongqing corp. 采購商 iec techologies, s. de r.l. de c.v.
• 出口港 57078, yantian 進口港 2704, los angeles, ca
• 供應(yīng)區(qū) China 采購區(qū) United States
• 重量 1321.34kg 金額 ——
• HS編碼 847330 產(chǎn)品標(biāo)簽 ct a,vent,mexico,keyboard,cf,arg,mill,a sv,unit,tin,w mat,lara,hpi,carton,lease,ale,bb,ion,ear,sant,cod,n bl,display
• 產(chǎn)品描述 ASSEMBLY,BASE, KEYBOARD,SUB, US,14 ASSEMBLY,CASE,REAR, DISPLAY,WLAN,THIN,14P PART N O: H6071352,H6071445 PO: 451 7044678,4517044717 INV: H629 071352,H629071445 HS CODE:84 73309000 200 CARTONS INTO 10 PALLETS HPI-IMX - RAW MATER IALS OCF/DESTINATION/LOCAL C HARGES COLLECT AT USA BY HP USA SVC:33101405359 AS THI S IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB8 TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION A RRANGEMENT. NOTIFY3: HP IN C. 1501 PAGE MILL ROAD SANTA CLARA 94304 PALO ALTOUNIT ED STATES AMS.OCEAN.PREALERT @ pHIPH.ACjO2M (650)857-1501 ---T EL : 1- (915) 298-5210 / 52- 656-2761340
  

• 交易日期 2025/03/09 提單編號 maeu248559303
• 供應(yīng)商 hp inc.inventec chongqing corp. 采購商 iec techologies, s. de r.l. de c.v.
• 出口港 57078, yantian 進口港 2704, los angeles, ca
• 供應(yīng)區(qū) China 采購區(qū) United States
• 重量 2322.43kg 金額 ——
• HS編碼 854232 產(chǎn)品標(biāo)簽 ct a,10k,vent,arg,control ler,flash memory,pwm control,keyboard,h61,mill,unit,ape,power,top,mexico,tin,hpi,otto,carton,lease,ale,power monitor,hub,cf,ion,controller,sbg,housing set,ear,usb,raw material,sant,bb,cod,uk,n bl,display
• 產(chǎn)品描述 IC,FLASH MEMORY,256M, -40 +8 5C,2.7 3.6V,1 IC,HUB CONTROL LER,DP 1.4,3 PORTS,BGA,168P IC,POWER MONITOR,1.7 5.5V ,DSBGA,8P,TR IC,POWER MONITO R,1.7 5.5V,DSBGA,8P,TR IC ,USB TYPE-C PORT CONTROLLER, QFN,40P,TR IC,PWM CONTROLLER ,3.1 3.5VV,10K 1MHZ,QFN S ET,TOP,HOUSING SET,HOUSING,B OTTOM ASSEMBLY,CASE,REAR, DISPLAY,WWAN,THICK,14 ASSEMB LY,CASE,TOP,UK,14P ASSEMBLY, BASE, KEYBOARD,SUB,US,14 T APE,SINGLE SIZE, 50000MM,15M M,0.1MM,KM-3 ASSEMBLY,CASE,B OTTOM,THICK,14W PART NO: H61 06834, H6071785,H6071950, H6077810,H6093428, H6093434, H6111399, H6111402,H6071046, H6071055,H6071367, H61013 31,H6111323, PO: 4517119366, 4517045218,4517045258, 45 17060474,4517100076, 4517100 082,4517137950, 4517137953,4 517044494, 4517044504,451704 4686, 4517118213,4517137879, INV: H629106834, H6290717 85,H629071950, H629077810,H6 29093428, H629093434,H629111 399, H629111402,H629071046, H629071055,H629071367, H62 9101331,H629111323, HS CODE: 8542329090, 8542319099,85423 99000, 8473309000,3919909090 , 362 CARTONS INTO 22 PALLET S HPI-IMX - RAW MATERIALS OCF/DESTINATION/LOCAL CHARGES COLLECT AT USA BY HP USA S VC:33101405359 AS THIS IS SP ECIAL ARRANGE, PLEASE TAKE T HE REMARK FOR BB8 TO INVENTE C MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REG ION FOR DESTINATION ARRANGEM ENT. NOTIFY3: HP INC. 15 01 PAGE MILL ROAD SANTA CLAR A 94304 PALO ALTOUNITED STAT ES AMS.OCEAN.PREALERT@ sHpPu.cCrONM (650)857-1501 ---TEL : 1- (915) 298-5210 / 52-656-276 1340
  

• 交易日期 2025/03/02 提單編號 maeu249380888
• 供應(yīng)商 hp inc.inventec chongqing corp. 采購商 iec techologies, s. de r.l. de c.v.
• 出口港 57078, yantian 進口港 2704, los angeles, ca
• 供應(yīng)區(qū) China 采購區(qū) United States
• 重量 1367.6kg 金額 ——
• HS編碼 847330 產(chǎn)品標(biāo)簽 ct a,vent,e ci,ale,cf,arg,mill,a sv,unit,tin,mexico,lara,hpi,lease,bb,cart,ion,ear,raw material,sant,cod,n bl,display
• 產(chǎn)品描述 ASSEMBLY,CASE,REAR, DISPLAY, WLAN,THICK,14 ASSEMBLY,CASE, REAR, DISPLAY,WLAN,THICK,14 PART NO:H6071658 H6071663 PO:4517044769 4517044770 INV:H629071658 H629071663 HS CODE:8473309000 200 CART ONS INTO 10 PALLETS HPI-IMX - RAW MATERIALS OCF/DESTINAT ION/LOCAL CHARGES COLLECT AT USA BY HP USA SVC:331014053 59 AS THIS IS SPECIAL ARRANG E, PLEASE TAKE THE REMARK FO R BB8 TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPE CIAL LIST TO REGION FOR DEST INATION ARRANGEMENT. NOTIF Y3: HP INC. 1501 PAGE MILL ROAD SANTA CLARA 94304 PALO ALTOUNITED STATES AMS.OCE AN.PREALERT@ tHaPk.tCnOFM (650)857- 1501 ---TEL : 1- (915) 298-5 210 / 52-656-2761340
  

• 交易日期 2025/03/02 提單編號 cmdushz7017688
• 供應(yīng)商 hp inc.inventec chongqing corp. 采購商 iec techologies, s. de r.l. de c.v.
• 出口港 57078, yantian 進口港 2704, los angeles, ca
• 供應(yīng)區(qū) China 采購區(qū) United States
• 重量 6625kg 金額 ——
• HS編碼 847330 產(chǎn)品標(biāo)簽 ct a,vent,4pin cable,pin,mexico,spring,frame,arg,sim card,module,flash memory,comb,keyboard,mill,unit,cmit,l hi,pera,usb type c,sds,tin,el ad,hpi,suit,pcb,carton,chip,lease,ale,ghwa,bb,s cable,lara,bt,ion,america,ear,via pcb,imperia,raw material,sant,cable,samsung,thermal module,santa fe,uv,display,cod,fr4,n bl,cro
• 產(chǎn)品描述 SET,FRAME,INNERPCB, TRANSFER,12L,FR4,MICRO VIA PCB,MB,12L,FR4,MICRO VIA PCB,KB TRANS,12L,FR4,UVIAS IC,FLASH MEMORY,64M,-40 +85C,2.7 3.6V,10 IC,FLASH MEMORY,512K,-40 +85C,2.3 3.6V,1 THERMAL MODULE,INTEL ADL U,UMA,28W,CHIPS CABLE,ROUND,24POS,1000MM,I,USB TYPE C CABLE,ROUND,4POS,52MM,I,4PIN TO 4PIN CABLE,ROUND,24POS,1000MM,E,TBT4 CMIT CABLE,ROUND,24POS,1000MM,E,TBT4 COMBO MODULE,SIM CARD ASSEMBLY,BASE,KEYBOARD,SUB,US,14 ASSEMBLY,CASE,REAR,DISPLAY,WLAN,THICK,14 ASSEMBLY,CASE,REAR,DISPLAY,WLAN,THICK,14 PART NO: H6099287,H6071589,H6071593, H6071608,H6093481,H6093499,H6099284, H6099285,H6099286,H6085794,H6085810, H6984263,H6071363,H6071544,H6071548, PO: 4517113305,4517045371,4517045372, 4517045375,4517100129,4517100147,4517113302, 4517113303,4517113304,4517079263,4517079271, 4516882692,4517044684,4517044744,4517044745, INV: H629099287,H629071589,H629071593, H629071608,H629093481,H629093499,H629099284, H629099285,H629099286,H629085794,H629085810, H628984263,H629071363,H629071544,H629071548, HS CODE: 8473309000 8534001000 8542329090 8544421900 8544421100 8523529000 383 CARTONS INTO 21 PALLETS HPI-IMX - RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA 0005579523 AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB8 TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. NOTIFY3: HP INC. 1501 PAGE MILL ROAD SANTA CLARA 94304 PALO ALTOUNITED STATES AMS.OCEAN.PREALERT OHqPQ.hCIOXM (650)857-1501 TEL : 1- (915) 298-5210 /52-656-2761340 2ND NOTIFY:SAMSUNG SDS AMERICA, INC. 12631 E.IMPERIAL HIGHWAY, SUITE F216, SANTA FE SPRING90670 LA.OPERATION SAMSUNG.COM JUN YEON KIM 714-497-6412
  

• 交易日期 2025/03/02 提單編號 cmdushz7017697
• 供應(yīng)商 hp inc.inventec chongqing corp. 采購商 iec techologies, s. de r.l. de c.v.
• 出口港 57078, yantian 進口港 2704, los angeles, ca
• 供應(yīng)區(qū) China 采購區(qū) United States
• 重量 6645kg 金額 ——
• HS編碼 847330 產(chǎn)品標(biāo)簽 ct a,vent,mexico,spring,ale,arg,mill,unit,high temp,l hi,pera,america,usb,tin,rj45,hpi,suit,carton,lease,led,ghwa,bb,sds,6 connector,lara,amb,amd,ion,jack,ear,imperia,raw material,sant,samsung,thermal module,santa fe,cod,chipset,n bl,display
• 產(chǎn)品描述 ASSEMBLY,CASE,REAR, DISPLAY,WLAN,THICK,14 ASSEMBLY,CASE,REAR, DISPLAY,WLAN,THICK,14 THERMAL MODULE,AMD FP7 U,UMA,28W,CHIPSET JACK+LED,GRE+AMB,RJ45, HIGH TEMP,12P,11.6 CONNECTOR,USB 3.0,DUAL, 8.38/15.44/18.24M PART NO: H6071540, H6071562,H6093507, H6094884,H6096043, PO: 4517044743, 4517044748,4517100155, 4517105589,4517108005, INV: H629071540, H629071562,H629093507, H629094884,H629096043, HS CODE: 8473309000,8536901100 362 CARTONS INTO 16 PALLETS HPI-IMX - RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA 0005579523 AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB8 TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. NOTIFY3: HP INC. 1501 PAGE MILL ROAD SANTA CLARA 94304 PALO ALTOUNITED STATES AMS.OCEAN.PREALERT vHsP4.lCAODM (650)857-1501 TEL : 1- (915) 298-5210 /52-656-2761340 2ND NOTIFY:SAMSUNG SDS AMERICA, INC. 12631 E.IMPERIAL HIGHWAY, SUITE F216, SANTA FE SPRING90670 LA.OPERATION SAMSUNG.COM JUN YEON KIM 714-497-6412
  

• 交易日期 2025/03/02 提單編號 maeu248041253
• 供應(yīng)商 hp inc.inventec chongqing corp. 采購商 iec techologies, s. de r.l. de c.v.
• 出口港 57078, yantian 進口港 2704, los angeles, ca
• 供應(yīng)區(qū) China 采購區(qū) United States
• 重量 4261.12kg 金額 ——
• HS編碼 292143 產(chǎn)品標(biāo)簽 10k,protection device,shield,duct,temperature sensor,nemo,ppo,ppm,usb charger,down,usb charge,rat,compa,inductor,tap,bat,4x4,al sc,sod,iver,mosfet,php,usb,crystal,n tr,chi,top,smt,diode,citor,el ad,current,tap cap,roller,lp,bead,gate,s 30,chip,104 capacitor,a cap,step down,wc,power,md,transistor,driver,amd,p10,r controller,bga ic,s form,step,flash memory,chips,x7,card,power switch,edr,convert,p1,analog switch,thermal module,cap,t2,controller,timer,resistor,regulator,d bracket,switch,bracket,mtl,tr tr,chipset,capacitor
• 產(chǎn)品描述 THERMAL MODULE,AMD FP11,55W, CHIPSET DOWN THERMAL MODULE, INTEL MTL_P,DIS,20W,20W,D THERMAL MODULE,INTEL ADL_U,U MA,28W,CHIPS THERMAL MODULE, AMD FP7_U,UMA,15W,CHIPSET THERMAL MODULE,INTEL MTL_P,D IS,20W,20W,D BRACKET,TOP SUP PORT,KU500,3 BRACKET,SUPPORT , AMD_TOP,SGCC,14 SHIELD,D DR,SUS 304 IC,USB TYPE-C CON TROLLER, 4.05.5V,3.23. IC, DRIVER MOSFET, 12A,TQFN,13P, TR IC,STEP DOWN CONTROLLER, DUAL,WQFN,20P,TR IC,CARD R EADER CONTROLLER,3.03.6V,USB 2. IC,RETIMER,3.03.6V, DP- ALT 2.1,USB 4,BGA IC,SYNC ST EP-DOWN REGULATOR,2.55.5V,2. 2 IC,STEP-DOWN REGULATOR, DC/DC,QFN,20P,TR IC,PWM CONT ROLLER, TQFN32-4X4,32P,TR IC,REDRIVER, DE_MUX,WQFN,40P ,TR IC,AND GATE,1.65-5.5V,ON E 2INPUT,TSSOP5, IC,POWER SWI TCH,2A,SOT-23-5,5P,TR IC,POWE R SWITCH,USB CHARGER,SOT25,5P, TR IC,POWER SWITCH,USB CHARGE R,SOT-23-5,5P, IC,PROTECTION DEVICE,ESD,22V,DFN2X2-3L,3 IC ,POWER SWITCH,TSOT-23-6A,6P,TR IC,POWER SWITCH,SOT23,5P,TR IC,POWER SWITCH,SOT-23-5,5P,T R IC,AND GATE,1.65.5V,2 INPUT ,SINGLE,TSSO IC,DC/DC CONVERT ER,SOT23-6,6P,TR IC,COMPARATO R,ONE,SOT23,5P,TR IC,SYNC STE P-DOWN REGULATOR,4.524VV,410 IC,TEMPERATURE SENSOR,MSOP,8P, TR IC,DRIVER MOSFET,30A,TQFN- 21,21P,TR IC,POWER SWITCH,TYP E-C CURRENT-LIMITED,U IC,SYNC STEP-DOWN REGULATOR,2.7V-6.5V ,TD IC,REGULATOR,FIX,3.3V,SOT -23,5P,TR IC,ANALOG SWITCH,UQ FN,16P,TR IC,FLASH MEMORY,8M, -40+85C,2.73.6V,104 CAPACITOR -CHIP,47UF,6.3V,M,X5R,0805,TR TRANSISTOR-FET,NMOSFET,30V,7A ,DFN3X3,8,T TRANSISTOR-FET,NE MOS,30V,35A,DFN3X3A,8P, INDUC TOR,2.2UH,+/- 20%,1MHZ,3A,3.4X 2.7X1 DIODE,ESD,24V,80A,SMD,S OT-23,TR DIODE,ESD,5V,3.5A,31 W,SMT,DFN2510P10E,TR DIODE,ES D,24V,SMD,DFN1006-2L,TR TRANS FORMER,1000,SMD,24P,15.6X9.47, TR TRANSISTOR-FET,NEMOS,60V,3 80MA,SC-70,3P, CAPACITOR-CHIP ,4.7UF,6.3V,M,X5R,0402,TR, CA PACITOR-CHIP,10UF,25V,M,X5R,06 03,TR DIODE-SCH-BAT54A-SOT23- TAP-PHP CAPACITOR-CHIP,10UF,6 .3V,M,X5R,0402,TR,0 CAPACITOR -CHIP,10UF,25V,K,X5R,0805,TR,1 . TRANSISTOR-FET,NMOSFET,20V, 300MA,EMT6,6P DIODE,ESD,5V,SM D,SOD523,TR CAPACITOR-CHIP,2. 2UF,6.3V,K,X5R,0603,TR, DIODE ,SWCH,80V,225MA,SMD,SOD323,TR CAPACITOR-CHIP,1UF,6.3V,M,X5R ,0201,TR,0. RESISTOR-M/F,0.01 ,1%,1W,1206,TR RESISTOR-M/F,0 .01,1%,1W,1206,TR CAPACITOR-C HIP,47UF,6.3V,M,X5R,0603,TR,0 DIODE,DUAL SCH,75V,150MA,4NS, SMD,SOT363, CAPACITOR-CHIP,1U F,10V,K,X5R,0402,TR DIODE,ESD ,1.5V,1MA,SMD,DFN2510P10E,TR CAPACITOR-CHIP,2.2UF,6.3V,M,X5 R,0201,TR, DIODE,SCH,30V,200M A,150MW,SMD,SOT-523,TR CAPACI TOR-AL-SP,330UF,2.5V,-35%/+10% ,-55 DIODE,ESD,3.3V,SMD,SOD-5 23,TR CAPACITOR-CHIP,10UF,10V ,K,X5R,0603,TR CAPACITOR-CHIP ,10UF,10V,K,X5R,0603,TR DIODE ,ESD,3.3V,6A,SMD,DFN2510P10E,T R CRYSTAL,25MHZ,20PPM,10PF,SM D,3.2X2.5,TR CRYSTAL,25MHZ,20 PPM,10PF,SMD,3.2X2.5X0.8 CAPA CITOR-CHIP,22UF,25V,M,X5R,0805 ,TR,1. CRYSTAL,27MHZ,10PPM,10 PF,SMD,3.2X2.5X0.7 CAPACITOR- CHIP,22UF,6.3V,M,X5R,0805,TR RESISTOR-M/F,0.002,1%,1W,1206, TR DIODE,ESD,3.3V,SMD,SLP0603 P2X3J,TR BEAD-180OHM-25%-1.5A -0.09OHM-0603INCH-10 BEAD,180 OHM,25%,1.5A,0.09OHM,0603INCH, 10 INDUCTOR,0.47UH,+/-20%,100 KHZ,17.5A,7.3X INDUCTOR,1.0UH ,20%,100KHZ,18A,11.5X10X4M IN DUCTOR,1UH,+/-20%,100KHZ,11A,6 .95X6.6X INDUCTOR,2.2UH,+/-20 %,100KHZ,8A,6.95X6.6 CAPACITO R-CHIP,100PF,50V,J,C0G,0402,TR CAPACITOR-CHIP,1000PF,50V,K, X7R,0402,TR CAPACITOR-CHIP,15 PF,50V,J,NPO,0402,TR CAPACITO R-CHIP,22PF,50V,J,C0G,0402,TR CAPACITOR-CHIP-0.022UF-K,16V- X7R-0402-TA CAPACITOR-CHIP-0. 1UF-J,10V-X7R-0402-TAP CAPACI TOR-CHIP-390PF-K,50V-X7R-0402- TAP CAPACITOR-CHIP,2200PF,50V ,K,X7R,0402,TR, CAPACITOR-CHI P,0.22UF,25V,K,X5R,0402,TR CA PACITOR-CHIP,0.33UF,25V,K,X5R, 0402,TR CAPACITOR-CHIP,8.2PF, 25V,D,C0G,0201,TR,0 RESISTOR- CHIP,0,5%,1/16W,0402,TR RESIS TOR-CHIP,10K,1%,1/16W,0402,TR RESISTOR-CHIP,100,5%,1/16W,04 02,TR RESISTOR-CHIP,1K,5%,1/1 0W,0603,TR RESISTOR-CHIP,150, 5%,1/16W,0402,TR RES-CHIP-150 K-5%-1/16W-0402-TAP RES-CHIP- 200K-1%-1/16W-0402-TAP RESIST OR-CHIP,2K,5%,1/16W,0402,TR R ESISTOR-CHIP,200K,5%,1/16W,040 2,TR RESISTOR-CHIP,22,5%,1/16